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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 5933708 B1

PDFFull Text
Date of Patent:
Aug. 03, 1999

Filed:

Apr. 17, 1997

Lead-on-chip semiconductor package and method for making the same

Applicant:
Inventors:

Sung Min Sim, Suwon, KR;

Young Hee Song, Seongnam, KR;

Young Do Kweon, Seoul, KR;

Hai Jeong Sohn, Suwon, KR;

Assignee:

Samsung Electronics, Co., Ltd., Kyungki-do, KR;

Attorney:

Marger Johnson & McCollom, P.C.

Primary Examiner:

Jey Tsai

Assistant Examiner:

David A Zarneke

Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
438118 ; 438123 ;
Abstract

A method for bonding a semiconductor chip to a lead frame in a LOC type semiconductor package in which a plurality of inner leads are bonded to an active surface of the semiconductor chip. A semiconductor chip is prepared with a partially-cured polyimide layer on the active surface. One or more strips of polyimide tape is attached to the inner leads. The semiconductor chip is attached to the inner leads by making an intermediate pressure bond between the polyimide tape and the partially-cured polyimide coating layer on the active surface. The polyimide coating layer is then cured.

Find Patent Forward Citations

Sim, Sung. (1999). Lead-on-chip semiconductor package and method for making the same (U.S. Patent No. 5933708). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5933708

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