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For the Inventor, By the Inventor

Yongin-si, South Korea

Hag Mo Kim

USPTO Granted Patents = 3 

Average Co-Inventor Count = 1.3

ph-index = 1

Forward Citations = 4(Granted Patents)


Location History:

  • Gyeonggi-do, KR (2016)
  • Yongin-Si, KR (2022)

Company Filing History:

goldMedal1 out of 854 
 
Dongbu Hitek Co., Ltd.
 patents
silverMedal2 out of 832,912 
Other
 patents

Years Active: 2016-2022

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3 patents (USPTO):Explore Patents
1. 11437556 - Graphite-laminated chip-on-film-type semiconductor package allowing improved visibility and workability (2022-09-06),
2. 11355687 - Graphite-laminated chip-on-film-type semiconductor package having improved heat dissipation and electromagnetic wave shielding functions (2022-06-07),
3. 9406583 - COF type semiconductor package and method of manufacturing the same (2016-08-02),
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