Yongin, South Korea

Hag Mo Kim

This inventor holds 3 USPTO granted patents and 4 published patent applications. Top assignees: Dongbu Hitek Co., Ltd., Other. Active years: 2016-2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hag Mo Kim. Retrieved from https://idiyas.com/inventor/hag-mo-kim

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 3 

% Patents Active = 100.0

Average Co-Inventor Count = 1.3

ph-index = 1

Forward Citations = 4(Granted Patents)


Location History:

  • Gyeonggi-do, KR (2016)
  • Yongin-Si, KR (2022)

Company Filing History:


Years Active: 2016-2022

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3 patents (USPTO):Explore Patents

Title: Hag Mo Kim: Innovator in Semiconductor Technology

Introduction

Hag Mo Kim is a prominent inventor based in Yongin, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His innovative work focuses on enhancing the functionality and efficiency of semiconductor packages.

Latest Patents

Hag Mo Kim's latest patents include a "Graphite-laminated chip-on-film-type semiconductor package allowing improved visibility and workability." This invention relates to a chip-on-film type semiconductor package that includes an integrated circuit chip, a printed circuit board layer, an outer lead bonder pad, and a graphite layer. The integrated circuit chip is connected to one surface of the printed circuit board layer directly or through a mounting element. The outer lead bonder pad is located on one surface of the printed circuit board layer, while the graphite layer is laminated on the opposite surface of the printed circuit board layer, along with a display device that includes the same.

Another notable patent is the "Graphite-laminated chip-on-film-type semiconductor package having improved heat dissipation and electromagnetic wave shielding functions." This invention also involves a chip-on-film type semiconductor package that includes an integrated circuit chip, a printed circuit board layer, and a graphite layer. The integrated circuit chip is connected to one surface of the printed circuit board layer directly or through a mounting element, with the graphite layer laminated on the opposite surface of the printed circuit board layer, enhancing the overall performance of the device.

Career Highlights

Throughout his career, Hag Mo Kim has worked with notable companies, including Dongbu Hitek Co., Ltd. His experience in the semiconductor industry has allowed him to develop innovative solutions that address various challenges in the field.

Collaborations

Hag Mo Kim has collaborated with talented individuals such as Jun Il Kim and Sung Jin Kim. These partnerships have contributed to the advancement of his projects and the successful development of his patents.

Conclusion

Hag Mo Kim is a distinguished inventor whose work in semiconductor technology has led to several innovative patents. His contributions continue to impact the industry positively, showcasing the importance of creativity and collaboration in technological advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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