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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11437556 B1

PDFFull Text
Date of Patent:
Sep. 06, 2022

Filed:

Aug. 21, 2018

Graphite-laminated chip-on-film-type semiconductor package allowing improved visibility and workability

Applicant:

Hag MO Kim, Yongin-Si, KR;

Inventor:

Hag Mo Kim, Yongin-Si, KR;

Assignee:

Other;

Attorney:

Polsinelli PC

Primary Examiner:

David A Zarneke

Int. Cl.
CPC ...
H01L 33/64 (2010.01); G02F 1/1345 (2006.01); H01L 23/00 (2006.01); H01L 23/373 (2006.01); H01L 23/498 (2006.01); H01L 23/552 (2006.01); G02F 1/1333 (2006.01);
U.S. Cl.
CPC ...
H01L 33/641 (2013.01); G02F 1/13452 (2013.01); H01L 23/3735 (2013.01); H01L 23/3737 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 23/49877 (2013.01); H01L 23/552 (2013.01); H01L 24/10 (2013.01); H01L 33/644 (2013.01); G02F 1/133308 (2013.01); H01L 24/02 (2013.01); H01L 2224/02 (2013.01); H01L 2224/10 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81 (2013.01); H01L 2924/15 (2013.01); H01L 2924/1517 (2013.01); H01L 2924/15763 (2013.01); H01L 2924/15786 (2013.01);
Abstract

The present invention relates to a chip-on film type semiconductor package including an integrated circuit chip, a printed circuit board layer, an outer lead bonder pad, and a graphite layer, in which the integrated circuit chip is connected to one surface of the printed circuit board layer directly or by means of a mounting element, the outer lead bonder pad is located on one surface of the printed circuit board layer, and the graphite layer is laminated on an opposite surface of the printed circuit board layer and a display device including the same.

Find Patent Forward Citations

Kim, Hag. (2022). Graphite-laminated chip-on-film-type semiconductor package allowing improved visibility and workability (U.S. Patent No. 11437556). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11437556

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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