H Dan Higgins

Title: H Dan Higgins: Innovator in Probe Testing Technology

Introduction

H Dan Higgins is a notable inventor based in Chandler, AZ, with a significant contribution to the field of probe testing technology. He holds a total of six patents, showcasing his innovative approach to enhancing the efficiency and effectiveness of integrated circuit testing.

Latest Patents

Among his latest patents is the "Alignment guide and signal transmission apparatus and method for spring contact probe needles." This invention addresses the challenge of achieving low probe needle contact resistance without the need for scrubbing against bonding pads. The design includes a probe needle assembly featuring multiple probe needles, each with a shank portion, a curved flex portion, and a contact tip. The assembly is engineered to maintain high test signal frequencies while ensuring optimal performance. Another significant patent is the "Probe card apparatus," which consists of a base element with a central cutout and an insert block that biases needle elements against electrical components on an integrated circuit chip. This innovative design enhances the reliability of testing processes.

Career Highlights

H Dan Higgins has worked with various companies, including Cerprobe Corporation, where he applied his expertise in probe testing technology. His career reflects a commitment to advancing the field through innovative solutions and practical applications.

Collaborations

Throughout his career, Higgins has collaborated with notable professionals such as R Dennis Bates and Rajiv Pandey. These collaborations have contributed to the development of cutting-edge technologies in the industry.

Conclusion

H Dan Higgins stands out as a prominent inventor in the realm of probe testing technology. His contributions, particularly through his patents, have significantly impacted the efficiency of integrated circuit testing. His work continues to inspire advancements in the field.