The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 13, 1999
Filed:
Apr. 17, 1997
H Dan Higgins, Chandler, AZ (US);
Martin A Martinez, Phoenix, AZ (US);
R Dennis Bates, Gilbert, AZ (US);
Cerprobe Corporation, Gilbert, AZ (US);
Abstract
A system for testing an integrated circuit on a semiconductor wafer so as to achieve low probe needle contact resistance with low probe needle force and without substantial scrubbing includes a probe and supporting a plurality of probe needles electrically coupled to an electrical test system above and in alignment with a plurality of contact pads of the integrated circuit, respectively. The wafer is mechanically moved to press probe needles to bring a tip of each probe needle into physical contact with a corresponding contact pad, and is further moved to increase a needle force of each tip against the corresponding contact pad and cause flexing of a curved portion of each probe needle. Each probe needle is curved such that the flexing causes the tip of each probe needle to rock without appreciable sliding on the surface of the contact pad. The rocking and the needle force combine to cause lateral displacement of oxide from between the tip and metal of the contact pad, allowing reliable, low resistance electrical contact between the tip and the contact pad.