Other

Cerprobe Corporation

H Dan Higgins

R Dennis Bates

Martin A Martinez

Son N Dang

Gerald Back

Peter J Normington

Scott R Williams

Rajiv Pandey

Norman J Armendariz

Probe testing of an integrated circuit so as to achieve low probe needle contact resistance without probe needles &ldquo;scrubbing&rdquo; against bonding pads is achieved at high test signal frequencies by a probe needle assembly ( ) including a plurality of probe needles ( ) each having a shank portion ( A), a curved flex portion ( B), and a contact tip ( C) on a free end of the flex portion, the shank portion ( A) being electrically coupled to an electrical test system. The shank portion ( A) of each probe needle is attached to a surface ( A) of an insulative layer ( ). The insulative layer is supported on a ground plane conductor . The flex portions ( B) of the probe needles ( ) extend beyond an edge of the insulative layer. A portion ( ) of the ground plane conductor ( ) extends beyond the insulator ( ) and is adjacent to all but an extending tip portion ( ) of the flex portion ( B) of each probe needle ( ). A thin insulator/guide layer ( B) is attached to the extending portion ( ) of the ground plane conductor ( ) and disposed between the extending portion and the flex portions ( B), the insulator/guide layer ( B) having a smooth, low friction surface to guide/stabilize the flex portions ( B) during flexing. The insulative layer ( ) and insulator/guide layer ( B) provide matched impedance between the shank and flex portions of the probe needles.

Alignment guide and signal transmission apparatus and method for spring contact probe needles

Probe card apparatus includes a base element having a central cutout portion and an insert block is disposed in the cut out portion. A probe card secured to the base element includes a plurality of needle elements which contact electrical elements on an integrated circuit chip on a wafer being tested. The base element and probe card are secured to a printed circuit board. The insert contacts the needle elements and biases them against the electrical elements being tested. The insert block is positionable relative to the base element and to the needle elements, and the base element is positionable relative to the printed circuit board.

Probe card apparatus

A system for testing an integrated circuit on a semiconductor wafer so as to achieve low probe needle contact resistance with low probe needle force and without substantial scrubbing includes a probe and supporting a plurality of probe needles electrically coupled to an electrical test system above and in alignment with a plurality of contact pads of the integrated circuit, respectively. The wafer is mechanically moved to press probe needles to bring a tip of each probe needle into physical contact with a corresponding contact pad, and is further moved to increase a needle force of each tip against the corresponding contact pad and cause flexing of a curved portion of each probe needle. Each probe needle is curved such that the flexing causes the tip of each probe needle to rock without appreciable sliding on the surface of the contact pad. The rocking and the needle force combine to cause lateral displacement of oxide from between the tip and metal of the contact pad, allowing reliable, low resistance electrical contact between the tip and the contact pad.

Probe assembly and method for switchable multi-DUT testing of integrated

A probe card assembly includes a probe card, an interposer and a probe array. The probe array includes a plurality of closely spaced pins, each pin includes a post and a beam, and each beam has a first end attached to the top of a post and a second end for contacting an integrated circuit. A bead on the second end of the beam assures that the free end of the beam will contact an IC first. For contacts on a grid, the beams extend diagonally relative to the rows and columns of the grid, enabling the beams to be longer. For contacts in a row on centers closer than the pins, two rows of pins straddle the contacts and the beams extend toward the contacts from opposite sides of the contacts. The probe array can be formed on the high density side of the interposer.

Probe card assembly for high density integrated circuits

Holder apparatus for holding an integrated circuit die for testing includes a carrier element for the die. The die is precisely located in the holder apparatus and a probe care which includes contact elements for contacting the appropriate pads on the die being tested is also secured to the holder apparatus and the card's probe needles are biased against the die. Different embodiments of the holder apparatus are disclosed, including holder apparatus with a removable alignment plate and holder apparatus with an integral alignment plate, both of which embodiments secure the die to the bottom of the holder apparatus, and holder apparatus in which the die or chip is secured to the top of the holder apparatus. Probe card apparatus usable with the various holder apparatus embodiments includes needles which comprise continuations of traces on the probe card and which include trace elements which may be connected directly to test circuitry without intermediate socket connectors.

Growing community of inventors

Chandler, AZ, United States of America

H Dan Higgins