Nes Ziona, Israel

Guy Nesher

This inventor holds 36 USPTO granted patents and 7 published patent applications and 11 EPO patents, primarily in 3D Printing Technology. Top assignees: Io Tech Group Ltd., Hp Indigo B.v., Hewlett-Packard Development Company, L.p.. Active years: 2018-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Guy Nesher. Retrieved from https://idiyas.com/inventor/guy-nesher

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 36 

% Patents Active = 80.6

 

Average Co-Inventor Count = 3.8

ph-index = 2

Forward Citations = 15(Granted Patents)


Location History:

  • Nes Ziona, IL (2018 - 2024)
  • Ness Ziona, IL (2019 - 2024)

Company Filing History:


Years Active: 2018-2025

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Areas of Expertise:
Laser Assisted Deposition
PCB Production
3D Printing
Negative 3D Printing
High Resolution Printing
Additive Manufacturing
Solder Paste Printing
Electrophotographic Ink
Cleaning Surfaces
Multicomponent Materials
Ablation Techniques
Surface Mounting
36 patents (USPTO):Explore Patents

Title: Innovations of Guy Nesher in PCB and 3D Printing Technologies

Introduction

Guy Nesher, located in Nes Ziona, Israel, is a prolific inventor with a remarkable portfolio of 35 patents. His innovative work primarily focuses on the development of advanced systems for printed circuit board (PCB) production and 3D printing technologies. His contributions have significantly advanced the fields of electronics and manufacturing.

Latest Patents

Among his latest patents, Guy Nesher has developed groundbreaking systems and methods for PCB production using laser systems. This innovation encompasses a laser-assisted deposition (LAD) system that enables the printing of flowable materials directly onto substrates to create integrated PCB structures for electronic devices. The patented system involves a jet printing unit, an imaging unit, curing units, and a drilling unit, effectively allowing the printing of metals and other materials such as epoxies and solder masks on PCB substrate materials like FR4. The process also includes options for sintering and ablating materials, with printed materials cured through heat or radiation methods.

In addition, he has created systems and methods for 3D printing using a vacuum-assisted laser printing machine. This technology allows for the transfer of materials onto an intermediate substrate at printing units, which can then be moved to a sample building unit. The innovative process may also involve coating systems, material curing, and various imaging and cleaning units, enhancing the efficiency and versatility of 3D printing applications.

Career Highlights

Guy Nesher has made substantial contributions to the technological landscape through his work at notable companies, including Io Tech Group Ltd. and HP Indigo B.V. His involvement in these organizations highlights his dedication to innovation and excellence in engineering applications.

Collaborations

Throughout his career, Guy has had the privilege of collaborating with talented individuals such as Michael Zenou and Ziv Gilan. These partnerships have fostered an environment of creativity and innovation, further propelling his research and development efforts in the field.

Conclusion

In summary, Guy Nesher's contributions to PCB and 3D printing technologies exemplify the transformative power of innovation in modern manufacturing. His extensive patent portfolio stands as a testament to his commitment to advancing these fields, ultimately shaping the future of electronics and production processes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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