Io Tech Group Ltd.

Hp Indigo B.v.

Hewlett-packard Development Company, L.P.

Reophotonics, Ltd.

Guy Nesher

Michael Zenou

Ziv Gilan

Tony Azzam

Samer Farran

Albert Teishev

Ilanit Mor

Haim Yosef Cohen

Getahun Biadglin

Yael Kowal-Blau

Yaron Grinwald

Alex Feygelman

Michael Kokotov

Nadav Shalem

Amir Kedem

Nurit Carmel-Barnea

Shahar Stein

Michael Vinokur

Benjamin Dayan

Eran Shiran

Shiran Zabar

Chen Talmor

Elina Ploshnik

Dror Kella

Peter Nedelin

Hannoch Ron

Boaz Tagansky

Eyal Shelef

Reut Avigdor

Gleb Romantcov

Tal Frank

Emad Masoud

Regina Guslitzer

Haim Vladomirski

Giries Kadis

Julia Kornilov

Martin Chauvin

Eyal Negreanu

Olga Kagan

Noam Parvin

Oron Ambar

Rada Nuchimov

Yuval Yunger

Eviatar Golan

Yaron Hershman

Biana Noikas

Craig Breen

Noam Meyuhas

In systems for printing a viscous material, the printing and post processing of the viscous material are performed sequentially one after another. In an initial step, a viscous material is printed on a sample mounted on a receiver substrate using a donor module and a laser scanner, and then the donor module is replaced with a post processing system for performing a post processing operation (and vice versa). Multiple post processing operations can be performed, and multiple different materials can be printed on the same layer. The systems can increase the speed, resolution and diversity of materials printed on the same sample, and opens the possibilities for new designs.

Systems for printing viscous materials using laser assisted deposition

Systems and methods for printing a printed circuit board (PCB) from substrate to full integration utilize a laser-assisted deposition (LAD) system to print a flowable material on top of a substrate by laser jetting to create a PCB structure to be used as an electronic device. One such system for PCB printing includes a jet printing unit, an imaging unit, curing units, and a drilling unit to print metals and other materials (epoxies, solder masks, etc.) directly on a PCB substrate such as a glass-reinforced epoxy laminate material (e.g., FR4) or others. The jet printing unit can also be used for sintering and/or ablation of materials. Printed materials are cured by heating or by infrared (IR) or ultraviolet (UV) radiation. PCBs produced according to the present systems and methods may be single-sided or double-sided.

PCB production by laser systems

Systems and methods in which a material or materials (e.g., a viscous material) are printed or otherwise transferred onto an intermediate substrate at a printing unit(s). The intermediate substrate having an image of material printed thereon is subsequently transferred to a sample building unit, and the image of material is transferred from the intermediate substrate to a sample at the sample building unit. Optionally, the printing unit(s) includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred from the donor substrate onto the intermediate substrate at the printing unit(s). Each of the printing units may employ a variety of printing or other transfer technologies. The system may also include material curing, heating, sintering, ablating, material filling, imaging and cleaning units to aid in the overall process.

Systems and methods for 3D printing with vacuum assisted laser printing machine

Systems and methods for printing a printed circuit board (PCB) from substrate to full integration utilize a laser-assisted deposition (LAD) system to print a flowable material on top of a substrate by laser jetting to create a PCB structure to be used as an electronic device. One such system for PCB printing includes a jet printing unit, an imaging unit, curing units, and a drilling unit to print metals and other materials (epoxies, solder masks, etc.) directly on a PCB substrate such as a glass-reinforced epoxy laminate material (e.g., FR4) or others. The jet printing unit can also be used for sintering and/or ablation of materials. Printed materials are cured by heating or by infrared (IR) or ultraviolet (UV) radiation. PCB s produced according to the present systems and methods may be single-sided or double-sided.

A method for fabricating a three-dimensional (3D) electronic device. A liquid support material (e.g., an epoxy acrylate with a photoinitiator) is applied by a laser-induced forward transfer (LIFT) process to a printed circuit board (PCB) having one or more connectors and one or more electronic components thereon, and then cured to solid form by cooling and/or exposure to ultraviolet (UV) radiation. A layer of conductive material (e.g., a metal) is printed on the solidified support material by LIFT to electrically connect the one or more electronic components to respective ones of the connectors on the PCB. Subsequently, the layer of conductive material is dried by heating and metal particles in the conductive layer sintered using a laser beam. The assembly may then be encapsulated in an encapsulant.

Method to electrically connect chip with top connectors using 3D printing

An example apparatus for determining dryness of an agent on print media includes an infrared prism, a source of infrared radiation to direct infrared radiation into the infrared prism, and a detector. The infrared prism includes a surface, the surface having an outer side to contact a portion of the agent on the print media, the infrared prism having a refractive index that is higher than a refractive index of the agent. The source of infrared radiation is to direct infrared radiation into the infrared prism and onto an inner side of the surface. The detector is to generate a signal based on infrared radiation reflected by the inner side of the surface to indicate the dryness of the portion of the agent.

Agents on print media

In a first approach, a vacuum cell comprises a porous plate and a vacuum force generated by gas being drawn thorough the porous plate is used to pick electronic components from a donor substrate. After transport of the vacuum cell to a placing area, dots of liquid material may be deposited on a top surface of the porous plate adjacent to one or more picked components in order to disrupt the vacuum force and release the picked components onto a receiving substrate. In a refinement of the first approach, the porous plate contains a plurality of picking holes for selectively picking components. Certain picking holes can be fluidly coupled to the vacuum, allowing components to be attached within those picking holes, while other picking holes can be closed or rendered inactive with dots of liquid material deposited on a top surface of the porous plate.

Systems for surface mounting electronic components on a printed circuit board

Methods and apparatus for the fabrication of solid three-dimensional objects from liquid polymerizable materials at high resolution. A material is coated on a film non-digitally, excess material is removed digitally, by laser, leaving an image of a layer to be printed, and the image is then engaged with existing portions of an object being fabricated and exposed to a non-digital heat source. Since the only part of the process that is digital is the material removal, and this part is done by laser, the speed of printing and the robustness of the manufacturing process is improved significantly over conventional additive or 3D fabrication techniques.

Methods and systems for negative 3D printing machine at high resolution

In an example, a print apparatus comprises an intermediate transfer member to receive thermoplastic print agent from a photoconductive surface, a rotatably mounted endless cleaning surface to receive a layer of thermoplastic print agent from the intermediate transfer member and a heater, to heat the endless cleaning surface. The endless cleaning surface may be to engage with the intermediate transfer member when heated to transfer residue from the intermediate transfer member to the layer of thermoplastic print agent on the endless cleaning surface.

Cleaning surfaces for print apparatus

Systems and methods in which dot-like portions of a material (e.g., a viscous material such as a solder paste) are printed or otherwise transferred onto an intermediate substrate at a first printing unit, the intermediate substrate having the dot-like portions of material printed thereon is transferred to a second printing unit, and the dot-like portions of material are transferred from the intermediate substrate to a final substrate at the second printing unit. Optionally, the first printing unit includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred in the individual dot-like portions from the donor substrate onto the intermediate substrate at the first printing unit. Each of the first and second printing units may employ a variety of printing or other transfer technologies. The system may also include material curing and imaging units to aid in the overall process.

Methods for printing solder paste and other viscous materials at high resolution

Methods and apparatus for the fabrication of solid three-dimensional objects from liquid polymerizable materials at high resolution. A material is coated on a film non-digitally, excess material is removed digitally, by laser, leaving an image of a layer to be printed, and the image is then engaged with existing portions of an object being fabricated and exposed to a non-digital UV curing light source. Since the only part of the process that is digital is the material removal, and this part is done by laser, the speed of printing and the robustness of the manufacturing process is improved significantly over conventional additive or 3D fabrication techniques.

Systems for negative 3D printing machine at high resolution

A three-dimensional device is fabricated in a layer-by-layer approach using a support material. The support material is deposited in a liquid form on a surface, hardened by cooling or ultraviolet (UV) curing, and selectively ablated to create an area within which the desired structure of the device will be formed. Active material is deposited into this area, and the layer-by-layer process repeated until the three-dimensional device has been completed. Thereafter, any remaining support material is removed by water or other solvent.

Methods of fabricating a 3D device using ablation

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Guy Nesher