For the Inventor, By the Inventor

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London, United Kingdom

Io Tech Group Ltd.

USPTO Granted Patents = 48

EPO Patents = 25

Forward Citations = 51

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15 inventors (with patents filed for the assignee):

Michael Zenou (44 out of 69 patents)

Ziv Gilan (32 out of 51 patents)

Guy Nesher (16 out of 36 patents)

4. Daniel Liptz (8 out of 8 patents)

5. Lorenz Josef Bonderer (5 out of 13 patents)

6. Wolfgang Josef Wachter (5 out of 24 patents)

7. Yuval Shai (4 out of 4 patents)

8. Jürgen Rudolf Laubersheimer (3 out of 8 patents)

9. Christian Ritzberger (1 out of 90 patents)

10. Hendrik John (1 out of 9 patents)

11. Jürgen Lauberscheimer (1 out of 1 patent)

12. Ziv Gilan (1 out of 1 patent)

13. Jürgen Laubersheimer (1 out of 1 patent)

14. Michael Zenou (1 out of 1 patent)

15. Ziv Gilan (1 out of 1 patent)

Core Competencies:

3D Printing

Energy-Pulse-Induced Transfer Printing

Laser Systems

PCB Production

Negative 3D Printing

Material Deposition

Solder Paste Printing

Additive Manufacturing

High Resolution Printing

Ablation Techniques

Conformal Materials

Multi-Material Dispensing

48 patents: Sort by Forward Citations

1. 12679032 - Methods for additive-ablative fabrication (2026-07-14),

2. 12509400 - Method for layer-wise manufacturing of a shaped body (2025-12-30),

3. 12319820 - Process and material for producing 3D objects by energy-pulse-induced transfer printing (2025-06-03),

4. 12238862 - PCB production by laser systems (2025-02-25),

5. 12179382 - Process for energy-pulse-induced transfer printing (2024-12-31),

6. 12109754 - Systems and methods for 3D printing with vacuum assisted laser printing machine (2024-10-08),

7. 12089328 - PCB production by laser systems (2024-09-10),

8. 12064899 - Support material for energy-pulse-induced transfer printing (2024-08-20),

9. 12059700 - Method for operating a wire-less variable gap coater device (2024-08-13),

10. 12046575 - Method to electrically connect chip with top connectors using 3D printing (2024-07-23),

11. 12010800 - Systems for surface mounting electronic components on a printed circuit board (2024-06-11),

12. 11877398 - PCB production by laser systems (2024-01-16),

13. 11872750 - Methods and systems for negative 3D printing machine at high resolution (2024-01-16),

14. 11865767 - Systems and methods for 3D printing with vacuum assisted laser printing machine (2024-01-09),

15. 11858211 - Systems for material deposition (2024-01-02),

IO Tech Group Ltd. is a technology consulting and solution provider, specializing in the development and implementation of innovative enterprise solutions. With a focus on leveraging the latest technologies, IO Tech Group helps businesses optimize their operations, enhance efficiency, and achieve digital transformation. Their comprehensive range of services covers areas such as software development, data analytics, cloud computing, cybersecurity, and IoT solutions. IO Tech Group is committed to delivering customized and scalable solutions that align with clients' specific needs and goals.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Sep 15 2026

48 Patents

#88 in London

#370 in United Kingdom

#14,509 in the World

London, United Kingdom

Io Tech Group Ltd.

Forward Citations = 51

15 inventors:

Michael Zenou (44 out of 69 patents)

Ziv Gilan (32 out of 51 patents)

Guy Nesher (16 out of 36 patents)

4. Daniel Liptz (8 out of 8 patents)

5. Lorenz Josef Bonderer (5 out of 13 patents)

Please report any incorrect information to [email protected]

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