Maple Glen, PA, United States of America

Guy Frick


Average Co-Inventor Count = 3.8

ph-index = 3

Forward Citations = 38(Granted Patents)


Company Filing History:


Years Active: 2007-2016

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3 patents (USPTO):Explore Patents

Title: Guy Frick: Innovator in Semiconductor Bonding and Alignment

Introduction

Guy Frick, an accomplished inventor based in Maple Glen, Pennsylvania, has made significant contributions to the field of semiconductor technology. With a total of three patents to his name, Frick has focused primarily on innovations involving thermocompression bonders and automated probe card methods. His work has played a crucial role in advancing semiconductor assembly processes.

Latest Patents

Frick's latest patents illustrate his expertise and innovative approach to semiconductor manufacturing. One of his key inventions is a thermocompression bonder, which includes a specialized bond head with a heated bonding tool designed to bond semiconductor elements to a substrate. Additionally, it features a flux application tool that applies flux material to conductive contacts of the substrate before the bonding process.

Another notable patent focuses on automated probe card planarization and alignment methods and tools. This invention provides a method and apparatus that enhances the alignment of probes on a probe card by comparing the desired horizontal location with the actual position. Frick's solution employs tools that automatically correct any misalignment, ensuring precision in the vertical positioning of the probes.

Career Highlights

Throughout his career, Guy Frick has worked with prominent companies in the semiconductor industry, including SV Probe and Kulicke and Soffa Industries, Inc. His roles at these organizations have allowed him to apply his inventive skills and further develop his patented technologies.

Collaborations

Frick has collaborated with notable professionals, such as Horst Clauberg and Bahadir Tunaboylu. These partnerships have contributed to refining his innovative concepts and enhancing the overall effectiveness of the technologies he has developed.

Conclusion

In summary, Guy Frick's dedication to innovation in thermocompression bonding and probe card alignment positions him as a prominent figure in the semiconductor field. His patents not only reflect his ingenuity but also contribute to the progress of semiconductor assembly practices, paving the way for advancements in technology.

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