The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 23, 2016
Filed:
Jun. 25, 2015
Applicant:
Kulicke and Soffa Industries, Inc., Fort Washington, PA (US);
Inventors:
Guy Frick, Maple Glen, PA (US);
Thomas J. Colosimo, Jr., West Chester, PA (US);
Horst Clauberg, Warwick, PA (US);
Assignee:
Kulicke and Soffa Industries, Inc., Fort Washington, PA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 31/02 (2006.01); H05K 3/34 (2006.01); B23K 1/00 (2006.01); B23K 1/20 (2006.01); B23K 3/04 (2006.01); B23K 3/08 (2006.01);
U.S. Cl.
CPC ...
H05K 3/34 (2013.01); B23K 1/0016 (2013.01); B23K 1/203 (2013.01); B23K 3/04 (2013.01); B23K 3/082 (2013.01); B23K 2201/42 (2013.01); H05K 2203/04 (2013.01);
Abstract
A thermocompression bonder is provided. The thermocompression bonder includes: a bond head including a heated bonding tool for bonding a semiconductor element to a substrate; and a flux application tool for applying a flux material to conductive contacts of the substrate prior to bonding of the semiconductor element to the substrate.