Guo Feng Lian

Title: Guo Feng Lian: Innovator in Wafer Processing Technology

Introduction

Guo Feng Lian is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of semiconductor packaging, particularly in wafer processing technologies. With a total of 3 patents to his name, Lian continues to push the boundaries of innovation in his industry.

Latest Patents

Lian's latest patents focus on the wafer process for molded chip scale packages (MCSP) with thick backside metallization. One of his notable inventions involves a comprehensive process that includes depositing metal bumps on bonding pads of chips on a wafer. The process also entails forming a first packaging layer at the front surface of the wafer, which covers the metal bumps while leaving an un-covered ring at the edge to expose the ends of each scribe line. This innovative approach allows for thinning the first packaging layer to reveal the metal bumps, forming cutting grooves, and grinding the back surface of the wafer to create a recessed space and a support ring. The process concludes with the separation of individual chips from the wafer by cutting through various layers along the scribe lines.

Career Highlights

Guo Feng Lian is currently employed at Alpha & Omega Semiconductor Corporation, where he applies his expertise in semiconductor technologies. His work has been instrumental in advancing the efficiency and effectiveness of wafer processing techniques.

Collaborations

Lian collaborates with talented coworkers, including Yan Xun Xue and Jun Lu, who contribute to the innovative environment at Alpha & Omega Semiconductor Corporation.

Conclusion

Guo Feng Lian is a key figure in the field of wafer processing technology, with a focus on molded chip scale packages. His innovative patents and contributions to the industry highlight his commitment to advancing semiconductor technology.