The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 22, 2014
Filed:
Feb. 29, 2012
Zhiqiang Niu, Songjiang, CN;
Ming-chen LU, Songjiang, CN;
Yan Xun Xue, Los Gatos, CA (US);
Yan Huo, Songjiang, CN;
Hua Pan, Songjiang, CN;
Guo Feng Lian, Songjiang, CN;
Jun LU, San Jose, CA (US);
Zhiqiang Niu, Songjiang, CN;
Ming-Chen Lu, Songjiang, CN;
Yan Xun Xue, Los Gatos, CA (US);
Yan Huo, Songjiang, CN;
Hua Pan, Songjiang, CN;
Guo Feng Lian, Songjiang, CN;
Jun Lu, San Jose, CA (US);
Alpha & Omega Semiconductor, Inc., Sunnyvale, CA (US);
Abstract
A semiconductor package is provided with an Aluminum alloy lead-frame without noble metal plated on the Aluminum base lead-frame. Aluminum alloy material with proper alloy composition and ratio for making an aluminum alloy lead-frame is provided. The aluminum alloy lead-frame is electroplated with a first metal electroplating layer, a second electroplating layer and a third electroplating layer in a sequence. The lead-frame electroplated with the first, second and third metal electroplating layers is then used in the fabrication process of a power semiconductor package including chip connecting, wire bonding, and plastic molding. After the molding process, the area of the lead-frame not covered by the molding compound is electroplated with a fourth metal electroplating layer that is not easy to be oxidized when exposing to air.