GunHyuck Lee

Title: Innovations by GunHyuck Lee

Introduction

GunHyuck Lee is a prominent inventor based in Incheon, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 6 patents. His work focuses on innovative interconnect devices and semiconductor assemblies, which are crucial for modern electronic applications.

Latest Patents

One of his latest patents is an interconnect device and semiconductor assembly incorporating an insulating frame. This device features a top insulating layer, a bottom insulating layer, and a central insulating layer with multiple insulators that create through-holes. The design allows for bridge conductors to be placed within these through-holes, enhancing the device's functionality. Another notable patent involves a semiconductor device that utilizes an interconnect substrate with a conductive via. This invention allows for the placement of electrical components on the side surfaces of the substrate, optimizing space and performance in semiconductor applications.

Career Highlights

GunHyuck Lee is currently employed at Stats Chippac Pte. Ltd., where he continues to innovate in the semiconductor industry. His expertise in interconnect devices has positioned him as a key player in advancing semiconductor technology.

Collaborations

He collaborates with talented coworkers, including SangHyun Son and HyunKyu Lee, who contribute to the innovative projects at Stats Chippac Pte. Ltd. Their teamwork fosters a creative environment that drives technological advancements.

Conclusion

GunHyuck Lee's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the field. His work continues to shape the future of electronic devices and systems.