Suwon-si, South Korea

Gun Hwi Hyung

USPTO Granted Patents = 2 

Average Co-Inventor Count = 5.3

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2021-2022

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2 patents (USPTO):Explore Patents

Title: Innovations of Gun Hwi Hyung

Introduction

Gun Hwi Hyung is a notable inventor based in Suwon-si, South Korea. He has made significant contributions to the field of electronics, particularly in the development of substrates and coil electronic components. With a total of two patents to his name, Hyung's work showcases his innovative approach to enhancing electronic device performance.

Latest Patents

Hyung's latest patents include a substrate with an electronic component embedded therein and a coil electronic component. The substrate features a core structure with a cavity, a metal layer on the bottom surface, and an electronic component placed on the metal layer. This design allows for excellent heat dissipation, which is crucial for the reliability of electronic devices. The coil electronic component consists of a body with multiple insulating layers and coil patterns, along with external electrodes that are connected to the coil patterns. These electrodes are designed with electroless plating layers and metal particles dispersed in a polymer base, enhancing their functionality.

Career Highlights

Gun Hwi Hyung is currently employed at Samsung Electro-Mechanics Co., Ltd., where he continues to innovate in the field of electronics. His work has contributed to the advancement of technology in various applications, making him a valuable asset to his company.

Collaborations

Hyung has collaborated with notable coworkers such as Chi Seong Kim and Jun Il Kang. Their teamwork has fostered an environment of creativity and innovation, leading to the successful development of new technologies.

Conclusion

Gun Hwi Hyung's contributions to the field of electronics through his patents and collaborations highlight his role as an influential inventor. His innovative designs are paving the way for advancements in electronic components, ensuring better performance and reliability in future technologies.

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