The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 2022
Filed:
Mar. 17, 2021
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Chang Hwa Park, Suwon-si, KR;
Chi Seong Kim, Suwon-si, KR;
Eun Heay Lee, Suwon-si, KR;
Yo Han Song, Suwon-si, KR;
Gun Hwi Hyung, Suwon-si, KR;
Jae Heun Lee, Suwon-si, KR;
Deok Man Kang, Suwon-si, KR;
Jin Oh Park, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/22 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/30 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0206 (2013.01); H05K 1/186 (2013.01); H05K 3/007 (2013.01); H05K 3/0097 (2013.01); H05K 3/22 (2013.01); H05K 3/305 (2013.01);
Abstract
A substrate with an electronic component embedded therein includes: a core structure having a cavity; a metal layer disposed on a bottom surface of the cavity of the core structure; and an electronic component disposed on the metal layer in the cavity of the core structure. The substrate with the electronic component embedded therein has an excellent heat dissipation effect.