Jae Heun Lee

Title: Innovations of Jae Heun Lee

Introduction

Jae Heun Lee is a notable inventor based in Suwon-si, South Korea. He has made significant contributions to the field of electronics, particularly in the development of printed circuit boards. With a total of three patents to his name, Lee's work showcases his expertise and innovative spirit.

Latest Patents

One of Jae Heun Lee's latest patents involves a printed circuit board that includes a first insulating layer with two cavities. This design features a first electronic component in one cavity and a second electronic component in the other, each with pads oriented in opposing directions. Additionally, the patent describes a second insulating layer that covers the first electronic component and a third insulating layer that covers the second electronic component.

Another patent by Lee also focuses on a printed circuit board, which consists of an insulating layer and a circuit layer. This circuit layer contains two circuit patterns, each with distinct side surfaces and heights. The innovative design allows for improved functionality and efficiency in electronic applications.

Career Highlights

Jae Heun Lee is currently employed at Samsung Electro-Mechanics Co., Ltd., a leading company in the electronics industry. His work at Samsung has allowed him to further develop his skills and contribute to cutting-edge technology in printed circuit board design.

Collaborations

Throughout his career, Lee has collaborated with talented coworkers, including Yong Soon Jang and Hyun Woo Kwon. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Jae Heun Lee's contributions to the field of electronics, particularly in printed circuit board technology, highlight his innovative capabilities as an inventor. His patents reflect a commitment to advancing technology and improving electronic designs.