Samsung Electro-Mechanics Co., Ltd.

Gun Hwi Hyung

Chi Seong Kim

Jin Su Park

Chang Hwa Park

Sa Yong Lee

Jun Il Kang

Jae Heun Lee

Deok Man Kang

Eun Heay Lee

Yo Han Song

A substrate with an electronic component embedded therein includes: a core structure having a cavity; a metal layer disposed on a bottom surface of the cavity of the core structure; and an electronic component disposed on the metal layer in the cavity of the core structure. The substrate with the electronic component embedded therein has an excellent heat dissipation effect.

Substrate with electronic component embedded therein

A coil electronic component includes a body including a plurality of insulating layers and coil patterns disposed on the insulating layers, and external electrodes formed on external surfaces of the body and connected to the coil patterns, wherein the external electrodes include first layers being electroless plating layers and second layers formed on the first layers and having a form in which metal particles are dispersed in a polymer base, respectively.

Coil electronic component

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Suwon-si, South Korea

Gun Hwi Hyung