Guan Keng Quah

Title: Innovations by Guan Keng Quah

Introduction

Guan Keng Quah is a notable inventor based in Gilbert, AZ, with a significant contribution to the field of semiconductor technology. He holds five patents that showcase his expertise in developing advanced methods for electronic chip attachment and packaging.

Latest Patents

One of his latest patents is titled "Method for making a direct chip attach device and structure." This patent describes a method for forming a direct chip attach device, which involves attaching an electronic chip to a lead frame structure that includes a flag. Conductive studs are then attached to bond pads on the electronic chip and flag to create a sub-assembly. This sub-assembly is placed in a molding apparatus, which consists of a first plate and a second plate. The second plate features a cavity designed to receive the electronic chip and flag, along with pins that contact the conductive studs during the molding step. This process prevents encapsulating material from covering the studs, thereby forming openings for solder balls in subsequent processing steps.

Another significant patent by Quah is the "Structure and method of direct chip attach." This patent outlines a semiconductor package that includes a die, a lead frame, a bond pad, encapsulation, and a wire bond ball. The wire bond ball is formed on the bond pad by bonding one end of a bond wire, with the remainder of the bond wire being removed. The locations for attaching the wire bond ball are recorded with reference to fiducials on the lead frame. The encapsulation covers the die and the die attach flag of the lead frame, while the wire bond ball is exposed where the encapsulation is removed. The locations for making openings to expose the wire bond ball are determined by recorded coordinates when the wire bond ball is formed.

Career Highlights

Guan Keng Quah has worked with prominent companies in the semiconductor industry, including Semiconductor Components Industries, LLC. His work has significantly impacted the development of semiconductor packaging technologies.

Collaborations

Throughout his career, Quah has collaborated with notable professionals such as James H. Knapp and Kok Yang Lau, contributing to advancements in semiconductor technology.

Conclusion

Guan Keng Quah's innovative contributions to semiconductor technology through his patents and collaborations highlight his role as a significant inventor in the field. His work continues to influence the development of electronic devices and packaging methods.