The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2006
Filed:
May. 25, 2004
Guan Keng Quah, Gilbert, AZ (US);
Guan Keng Quah, Gilbert, AZ (US);
Semiconductor Components Industries, L.L.C., Phoenix, AZ (US);
Abstract
A semiconductor package () has a die (), a leadframe (), a bond pad (), an encapsulation () and a wire bond ball (). The wire bond ball is formed on the bond pad by bonding one end of a bond wire (), and remainder of the bond wire is removed. Locations () for attaching the wire bond ball are recorded with reference to fiducials () on the lead frame. The encapsulation covers the die, deposits and die attach flag () of the lead frame. The wire bond ball is exposed where the encapsulation is removed. The locations for making openings () for exposing the wire bond ball is determined by recorded coordinates when the wire bond ball is formed. Exposed wire bond ball is plated, forming a lead to electrically connect to the die.