The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 05, 2006
Filed:
Jun. 26, 2003
Yeu Wen Lee, Seremban, MY;
Chuan Kiak NG, Negei Sembilan, MY;
Guan Keng Quah, Gilbert, AZ (US);
Semiconductor Components Industries, LLC, Phoenix, AZ (US);
Abstract
A method for forming a direct chip attach device () includes attaching an electronic chip () to a lead frame structure (), which includes a flag (). Next, conductive studs () are attached to bond pads () on electronic chip () and flag () to form a sub-assembly (). Sub-assembly () is then placed in a molding apparatus (), which includes a first plate () and second plate (). Second plate () includes a cavity () for receiving electronic chip () and flag (), and pins (). During a molding step, pins () contact conductive studs () to prevent encapsulating material () from covering studs (). This forms openings () to receive solder balls () during a subsequent processing step.