Location History:
- Negei Sembilan, MY (2006)
- Negeri Sembilan, MY (2006 - 2007)
Company Filing History:
Years Active: 2006-2007
Title: Chuan Kiak Ng: Innovator in Semiconductor Technology
Introduction
Chuan Kiak Ng is a notable inventor based in Negeri Sembilan, Malaysia. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on enhancing the efficiency and functionality of semiconductor packages.
Latest Patents
One of his latest patents is titled "Semiconductor package and leadframe therefor having angled corners." This invention features a leadframe for a semiconductor package that includes an indentation on its bottom surface. This indentation is utilized to create a mold-lock, which aids in securing the leadframe to the encapsulation material of the semiconductor package. Another significant patent is "Method for making a direct chip attach device and structure." This method involves attaching an electronic chip to a lead frame structure, which includes a flag. Conductive studs are then attached to bond pads on the electronic chip and flag to form a sub-assembly. This sub-assembly is placed in a molding apparatus, where specific steps are taken to ensure that encapsulating material does not cover the conductive studs, allowing for the formation of openings to receive solder balls during subsequent processing.
Career Highlights
Chuan Kiak Ng has worked with reputable companies in the semiconductor industry, including Semiconductor Components Industries, LLC. His experience in these organizations has contributed to his expertise and innovative capabilities in semiconductor technology.
Collaborations
Throughout his career, Chuan Kiak Ng has collaborated with talented individuals such as Yeu Wen Lee and Ein Sun Ng. These collaborations have likely fostered a creative environment that has led to the development of his innovative patents.
Conclusion
Chuan Kiak Ng is a distinguished inventor whose work in semiconductor technology has resulted in valuable patents that enhance the functionality of semiconductor packages. His contributions continue to impact the industry positively.