Semiconductor Components Industries, LLC

Chuan Kiak Ng

Yeu Wen Lee

Ein Sun Ng

Guan Keng Quah

A leadframe for a semiconductor package is formed with an indentation on a bottom surface. A side of the indentation is used to form a mold-lock that assists in securing the leadframe to the encapsulation material of the semiconductor package.

Semiconductor package and leadframe therefor having angled corners

A method for forming a direct chip attach device () includes attaching an electronic chip () to a lead frame structure (), which includes a flag (). Next, conductive studs () are attached to bond pads () on electronic chip () and flag () to form a sub-assembly (). Sub-assembly () is then placed in a molding apparatus (), which includes a first plate () and second plate (). Second plate () includes a cavity () for receiving electronic chip () and flag (), and pins (). During a molding step, pins () contact conductive studs () to prevent encapsulating material () from covering studs (). This forms openings () to receive solder balls () during a subsequent processing step.

Growing community of inventors

Negeri Sembilan, Malaysia

Chuan Kiak Ng