The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 28, 2004
Filed:
Jun. 26, 2003
James Knapp, Gilbert, AZ (US);
Kok Yang Lau, Asahan Melaka, MY;
Beng Lian Lim, Negeri Sembilan, MY;
Guan Keng Quah, Gilbert, AZ (US);
Semiconductor Components Industries, L.L.C., Phoenix, AZ (US);
Abstract
A method for forming a direct chip attach (DCA) device ( ) includes attaching a chip ( ) to a lead frame ( ). Conductive studs ( ) are attached to bonding pads ( ) on the chip ( ) and a flag ( ) on lead frame ( ). The chip ( ) and flag ( ) are enclosed with an encapsulating layer ( ), and openings ( ) are formed in an upper surface ( ) to expose conductive studs ( ). In one embodiment, a masking layer ( ) is applied to the lead frame ( ), and the structure is then placed in an electroless plating apparatus ( ). While in the plating apparatus ( ), an injection device ( ) injects plating solution ( ) towards the upper surface ( ) and openings ( ) to enhance the formation of barrier layers ( ) on the conductive studs ( ). Solder bumps ( ) are then attached to barrier layers ( ) through the openings ( ).