Beng Lian Lim

Title: The Innovations of Beng Lian Lim

Introduction

Beng Lian Lim is a notable inventor based in Negeri Sembilan, Malaysia. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique patent that enhances the efficiency of chip attachment processes.

Latest Patents

Beng Lian Lim holds a patent for a "Direct chip attach structure and method." This invention involves a method for forming a direct chip attach (DCA) device. The process includes attaching a chip to a lead frame, where conductive studs are connected to bonding pads on the chip and a flag on the lead frame. The chip and flag are then enclosed with an encapsulating layer, and openings are formed in the upper surface to expose the conductive studs. In one embodiment, a masking layer is applied to the lead frame, and the structure is placed in an electroless plating apparatus. While in the plating apparatus, an injection device injects plating solution towards the upper surface and openings to enhance the formation of barrier layers on the conductive studs. Finally, solder bumps are attached to the barrier layers through the openings.

Career Highlights

Beng Lian Lim is currently employed at Semiconductor Components Industries, L.L.C. His work at this company has allowed him to focus on advancing semiconductor technologies. His innovative approach has contributed to the development of more efficient electronic components.

Collaborations

Beng Lian Lim has collaborated with notable colleagues, including James H. Knapp and Kok Yang Lau. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Beng Lian Lim's contributions to semiconductor technology through his patent and collaborations highlight his role as a significant inventor in the field. His work continues to influence advancements in electronic component design and manufacturing.