Semiconductor Components Industries, LLC

Beng Lian Lim

James H Knapp

Guan Keng Quah

Kok Yang Lau

A method for forming a direct chip attach (DCA) device ( ) includes attaching a chip ( ) to a lead frame ( ). Conductive studs ( ) are attached to bonding pads ( ) on the chip ( ) and a flag ( ) on lead frame ( ). The chip ( ) and flag ( ) are enclosed with an encapsulating layer ( ), and openings ( ) are formed in an upper surface ( ) to expose conductive studs ( ). In one embodiment, a masking layer ( ) is applied to the lead frame ( ), and the structure is then placed in an electroless plating apparatus ( ). While in the plating apparatus ( ), an injection device ( ) injects plating solution ( ) towards the upper surface ( ) and openings ( ) to enhance the formation of barrier layers ( ) on the conductive studs ( ). Solder bumps ( ) are then attached to barrier layers ( ) through the openings ( ).

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Negeri Sembilan, Malaysia

Beng Lian Lim