Location History:
- Munich, DE (2008 - 2015)
- München, DE (2005 - 2018)
Company Filing History:
Years Active: 2005-2018
Title: Gregor Feiertag – Innovative Mind in MEMS Technology
Introduction
Gregor Feiertag, an esteemed inventor based in Munich, Germany, has made significant contributions to the field of Micro-Electro-Mechanical Systems (MEMS). With a remarkable portfolio of 17 patents to his name, Feiertag has consistently pushed the boundaries of innovation in sensor technologies and miniaturization.
Latest Patents
Among his latest creations is the "Multi-MEMS Module," which is designed for efficient production while enabling a more compact design. This innovative module features a housing with an interior, as well as a first and second opening. It includes two MEMS chips, where the first is acoustically coupled to the first opening, and the second to the second opening. Another significant patent is the "Sensor Module and Method for Producing Sensor Modules." This module includes a carrier, at least one sensor chip, and an evaluation chip that is electrically connected to the sensor chip, demonstrating Feiertag's expertise in enhancing sensor functionality and integration.
Career Highlights
Gregor Feiertag has worked for respected organizations such as Epcos AG and TDK Corporation, where he further honed his skills in MEMS technology and sensor development. His contributions to these companies reflect his dedication to advancing electronic and sensor technologies, positioning him as a key figure in the industry.
Collaborations
Feiertag’s work is enriched by collaborations with notable colleagues, including Alois Stelzl and Wolfgang Pahl. Their combined expertise has fostered an environment of innovation, leading to groundbreaking developments in sensor technology.
Conclusion
In conclusion, Gregor Feiertag stands out as an influential inventor in the MEMS sector. With a rich history of patents and collaborations, he continues to inspire future innovations that shape the technology landscape. His work not only demonstrates the potential of micro-electromechanical systems but also sets the foundation for future advancements in sensor applications.