The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2009
Filed:
Jun. 14, 2002
Alois Stelzl, Munich, DE;
Hans Krueger, Munich, DE;
Gregor Feiertag, Munich, DE;
Ernst Christl, Vilsbiburg, DE;
Alois Stelzl, Munich, DE;
Hans Krueger, Munich, DE;
Gregor Feiertag, Munich, DE;
Ernst Christl, Vilsbiburg, DE;
EPCOS AG, Munich, DE;
Abstract
A method is provided to produce a hermetic encapsulation for an electronic component, which may be an optical and at least partially light-permeable component or a surface wave component, comprises attaching and electrically contacting a component based on a chip to a carrier comprising electrical connection surfaces, such that a front of the chip bearing component structures facing the carrier is arranged to clear it, covering a back of the chip with a film made of synthetic material, such that edges of the film overlap the chip; tightly bonding the film and carrier in an entire edge region around the chip; structuring the film such that the film is removed around the edge region in a continuous strip parallel to the edge region; and applying a hermetically sealing layer over the film, such that this layer hermetically terminates with the carrier in a contact region outside of the edge region.