Epcos Ag

Tdk Corporation

Gregor Feiertag

Alois Stelzl

Wolfgang Pahl

Anton Leidl

Hans Krueger

Hans Krüger

Christian Bauer

Jürgen Portmann

Christian Siegel

Alexander Schmajew

Stefan Seitz

Karl Nicolaus

Ernst Christl

Matthias Winter

A multi-MEMS module is specified which can be produced expediently and enables a smaller design. The module comprises a housing having an interior and a first and a second opening, a first MEMS chip and a second MEMS chip. The first MEMS chip is acoustically coupled to the first opening. The second MEMS chip is acoustically coupled to the second opening.

Multi-MEMS module

Sensor module, comprising a carrier, at least one sensor chip and at least one evaluation chip which is electrically coupled to the sensor chip. The carrier has a cutout, in which the sensor chip is at least partly situated. The evaluation chip is arranged on the carrier and at least partly covers the cutout.

Sensor module and method for producing sensor modules

The invention relates to a miniaturized electrical component comprising an MEMS chip and an ASIC chip. The MEMS chip and the ASIC chip are disposed on top of each other; an internal mounting of MEMS chip and ASIC chip is connected to external electrical terminals of the electrical component by means of vias through the MEMS chip or the ASIC chip.

Miniaturized electrical component comprising an MEMS and an ASIC and production method

Method for producing an MST device, and MST device A method for producing an electromechanical transducer is described, wherein

Method for encapsulating an MEMS component

The invention relates to a method for producing a microphone, in which a transducer element (WE) is mounted on a carrier (TR); a cover is arranged over the transducer element (WE) and the carrier (TR) such that the transducer element (WE) is enclosed between the cover and the carrier (TR); a first sound inlet opening (S) is produced in the carrier (TR); a functional test of the microphone is carried out; the first sound inlet opening (S) is closed; and a second sound inlet opening (S) is created in the cover. The present invention further relates to a microphone resulting from the method, in which the first sound inlet opening (S) is prepared but closed.

MEMS microphone and method for producing the MEMS microphone

A MEMS component includes a substrate in which at least one cavity is present. The cavity is closed off toward an active side of the substrate. An inactive side is arranged opposite the active side of the substrate, and the substrate is covered with a covering film on the inactive side.

MEMS component, method for producing a MEMS component, and method for handling a MEMS component

An MEMS package is proposed, wherein a chip having MEMS structures on its top side is connected to a rigid covering plate and a frame structure, which comprises a polymer, to form a sandwich structure in such a way that a closed cavity which receives the MEMS structures is formed. Solderable or bondable electrical contact are arranged on the rear side of the chip or on the outer side of the covering plate which faces away from the chip, and are electrically conductively connected to at least one connection pad by means of an electrical connection structure.

MEMS package and method for the production thereof

On a carrier () an adhesion layer (), an ASIC chip () and a sensor chip () are arranged one above another. An interchip connection () is provided for electrically connecting the chips among one another, and an ASIC connection () is provided for externally electrically connecting the circuit integrated in the ASIC chip.

Semiconductor chip arrangement with sensor chip and manufacturing method

A microphone package wherein an MEMS microphone chip (MIC) is mounted on a substrate (SUB) and is sealed with a cover (ABD) with respect to the substrate. The membrane (MMB) of the microphone chip is connected to a sound entry opening (SEO) in the substrate via an acoustic channel. As a result of defined dimensioning of, in particular, the cross section and length of sound entry opening and channel, an acoustic low-pass filter is formed, the &#x2212;3 dB attenuation point of which is significantly below the natural resonance of microphone membrane and package.

MEMS microphone

An arrangement includes a circuit carrier and a housed microphone. A mounting side of the housed microphone is mounted on a top side of the circuit carrier. The housed microphone includes solderable contacts on the mounting side and a sound entry opening facing the circuit carrier. An acoustic channel connects the sound entry opening and surroundings above the circuit carrier.

Arrangement comprising a microphone

A carrier substrate has a mounting location with a number of electrical connection pads on a top side and external contacts connected thereto on an underside. A metal frame encloses the connection pads of the mounting location. A MEMS chip has electrical contacts on an underside. The MEMS chip is placed on the mounting location of the carrier substrate in such a way that the MEMS chip is seated with an edge region of its underside on the metal frame. Using a flip-chip process, the electrical contacts of the MEMS chip are connected to the connection pads of the carrier substrate by means of bumps the metal frame is connected to the MEMS chip such that a closed cavity is formed between MEMS chip and carrier substrate.

Method for producing a MEMS package

A component includes a first substrate having a first front side for holding first component structures, and a second substrate having a second front side for holding second component structures. The first and second substrates are connected together electrically and mechanically. The first and second front sides face each other. The first and second component structures include SAW structures, FBAR structures, MEMS sensors or switches, or MEOPS components, or combinations thereof.

Electrical component and production method

A method is provided to produce a hermetic encapsulation for an electronic component, which may be an optical and at least partially light-permeable component or a surface wave component, comprises attaching and electrically contacting a component based on a chip to a carrier comprising electrical connection surfaces, such that a front of the chip bearing component structures facing the carrier is arranged to clear it, covering a back of the chip with a film made of synthetic material, such that edges of the film overlap the chip; tightly bonding the film and carrier in an entire edge region around the chip; structuring the film such that the film is removed around the edge region in a continuous strip parallel to the edge region; and applying a hermetically sealing layer over the film, such that this layer hermetically terminates with the carrier in a contact region outside of the edge region.

Method for hermetically encapsulating a component

An arrangement having a component mounted on a carrier in a flip chip construction which is encapsulated by a film, in particular a plastic film, laminated over the entire surface of the component. For additional sealing and mechanical stabilization, a plastic compound in liquid form is subsequently applied and hardened so as to surround the chip.

Method for encapsulating an electrical component, and surface acoustic wave device encapsulated using said method

The present invention relates to an encapsulated component that includes a carrier substrate and at least one chip positioned on the top of the carrier substrate and electrically connected to it by means of electrically conductive connections. The encapsulation of the chip is accomplished with a seal or dielectric layer. As a result of differing coefficients of expansion of the seal or dielectric layer and the electrically conductive connections, with changing temperatures stresses occur in the electrically conductive connections, which can lead to cracks, breaks and even to interruption of the electrically conductive connections. To mechanically relieve the electrically conductive connections of stresses from changing temperatures (in particular under extreme thermal loads), it is proposed that the carrier substrate be provided with a support element that encircles the chip, which serves to support the seal or dielectric layer, and/or that the material and the arrangement of the encapsulation be selected accordingly.

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Munich, Germany

Gregor Feiertag