The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2015
Filed:
Jan. 24, 2011
Applicants:
Gregor Feiertag, Munich, DE;
Hans Krueger, Munich, DE;
Wolfgang Pahl, Munich, DE;
Anton Leidl, Hohenbrunn, DE;
Inventors:
Gregor Feiertag, Munich, DE;
Hans Krueger, Munich, DE;
Wolfgang Pahl, Munich, DE;
Anton Leidl, Hohenbrunn, DE;
Assignee:
Epcos AG, Munich, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/72 (2006.01); B81B 7/00 (2006.01); B81C 1/00 (2006.01); G01L 9/00 (2006.01); H01L 23/10 (2006.01); H04R 19/04 (2006.01); H01L 23/552 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0061 (2013.01); B81B 2201/0257 (2013.01); B81B 2207/012 (2013.01); B81C 1/00238 (2013.01); G01L 9/0073 (2013.01); H04R 19/04 (2013.01); H01L 23/10 (2013.01); H01L 23/552 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/94 (2013.01); H01L 25/0657 (2013.01); H01L 2224/131 (2013.01); H01L 2224/133 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/29011 (2013.01); H01L 2224/29013 (2013.01); H01L 2224/291 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/293 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/73203 (2013.01); H01L 2224/81801 (2013.01); H01L 2224/83825 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83851 (2013.01); H01L 2224/94 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/163 (2013.01); H01L 2224/27438 (2013.01); H01L 2224/1329 (2013.01); H01L 2224/8185 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06541 (2013.01); B81C 1/00309 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/07811 (2013.01);
Abstract
The invention relates to a miniaturized electrical component comprising an MEMS chip and an ASIC chip. The MEMS chip and the ASIC chip are disposed on top of each other; an internal mounting of MEMS chip and ASIC chip is connected to external electrical terminals of the electrical component by means of vias through the MEMS chip or the ASIC chip.