Going Sik Kim

Title: Innovations of Going Sik Kim

Introduction

Going Sik Kim is a notable inventor based in Cheongju-si, South Korea. He has made significant contributions to the field of electronics, particularly in the development of printed circuit boards and multi-chip packages. With a total of 3 patents to his name, Kim continues to push the boundaries of technology.

Latest Patents

One of his latest patents is a method of manufacturing a rigid-flexible printed circuit board. This innovative method involves providing a base substrate with coverlays formed on both sides of a flexible copper foil laminate. The process includes layering insulation and copper foil layers, forming via holes, and applying solder resists to enhance the functionality of the circuit board. Another significant patent is for a multi-chip package, which addresses signal distortions that can occur during power delivery. This invention ensures that the lengths of metal wires connecting semiconductor chips are optimized to prevent any electrical issues.

Career Highlights

Going Sik Kim is currently employed at Samsung Electro-Mechanics Co., Ltd., where he applies his expertise in electronics and innovation. His work has been instrumental in advancing the company's technological capabilities and product offerings.

Collaborations

Kim has collaborated with notable colleagues such as Yang Je Lee and Il Woon Shin, contributing to various projects that enhance the company's research and development efforts.

Conclusion

Going Sik Kim's contributions to the field of electronics through his patents and work at Samsung Electro-Mechanics Co., Ltd. highlight his role as an influential inventor. His innovative methods and designs continue to shape the future of technology.