The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2015
Filed:
Dec. 29, 2011
Applicants:
Hye Jin Kim, Gyunggi-do, KR;
Going Sik Kim, Gyunggi-do, KR;
Chang Sup Ryu, Gyunggi-do, KR;
Inventors:
Assignee:
Samsung Electro-Mechanics Co., Ltd., Gyunggi-Do, KR;
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2006.01); H01L 23/13 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 24/48 (2013.01); H01L 23/49827 (2013.01); H01L 25/0657 (2013.01); H01L 23/13 (2013.01); H01L 24/45 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32014 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/451 (2013.01); H01L 2224/4809 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48235 (2013.01); H01L 2224/4824 (2013.01); H01L 2224/73215 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83101 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/014 (2013.01); H01L 2924/15311 (2013.01); H01L 23/3128 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/06135 (2013.01); H01L 2224/06136 (2013.01); H01L 2225/0651 (2013.01); H01L 2924/01033 (2013.01); H01L 2225/06558 (2013.01); H01L 2924/01028 (2013.01); H01L 2224/73203 (2013.01);
Abstract
The preferred embodiment of the present invention can prevent signal distortions such as stress, or the like, occurring at the time of power delivery due to the difference in the lengths of the metal wires for electrically connecting each of the plurality of semiconductor chips formed on the dual die package substrate.