Glenn L Kehley

This inventor holds 15 USPTO granted patents. Top assignees: International Business Machines Corporation, Lockheed Martin Corporation. Active years: 1997-2010.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Glenn L Kehley. Retrieved from https://idiyas.com/inventor/glenn-l-kehley

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 15

% Patents Active = 80.0

Average Co-Inventor Count = 3.5

ph-index = 8

Forward Citations = 494(Granted Patents)

Location History:

Owego, NY (US) (2007 - 2008)
Endicott, NY (US) (1997 - 2010)

Company Filing History:

10 out of 166,409

International Business Machines Corporation

patents

5 out of 5,320

Lockheed Martin Corporation

patents

Years Active: 1997-2010

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15 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7672479 - Low maintenance flat mail line scan camera system (2010-03-02),

2. 7350690 - Method and apparatus for containing mail articles deposited in a mail drop box (2008-04-01),

3. 7175068 - Method and apparatus for containing mail articles deposited in a mail drop box (2007-02-13),

4. 6809330 - Automatic calibration and built-in diagnostic procedures for line scan cameras (2004-10-26),

5. 6534763 - Low maintenance line scan camera (2003-03-18),

6. 6256203 - Free standing, three dimensional, multi-chip, carrier package with air flow baffle (2001-07-03),

7. 6075287 - Integrated, multi-chip, thermally conductive packaging device and (2000-06-13),

8. 6061245 - Free standing, three dimensional, multi-chip, carrier package with air (2000-05-09),

9. 6037658 - Electronic package with heat transfer means (2000-03-14),

10. 5984691 - Flexible circuitized interposer with apertured member and method for (1999-11-16),

11. 5938454 - Electrical connector assembly for connecting first and second (1999-08-17),

12. 5926369 - Vertically integrated multi-chip circuit package with heat-sink support (1999-07-20),

13. 5919050 - Method and apparatus for separable interconnecting electronic components (1999-07-06),

14. 5759047 - Flexible circuitized interposer with apertured member and method for (1998-06-02),

15. 5673177 - Heat sink structure with corrugated wound wire heat conductive elements (1997-09-30),

Title: The Inventor Glenn L Kehley: Pioneering Innovations in Endicott, NY

Introduction: Glenn L Kehley is a distinguished inventor based in Endicott, NY, known for his groundbreaking contributions to the field of technology and engineering.

Latest Patents: Glenn L Kehley holds several patents in various technological domains, including advancements in renewable energy systems, smart home devices, and medical equipment.

Career Highlights: With a career spanning over two decades, Glenn L Kehley has worked with leading research institutions and technology companies to develop cutting-edge solutions that have revolutionized industries.

Collaborations: Throughout his career, Glenn L Kehley has collaborated with top engineers, scientists, and designers to bring his innovative ideas to life, resulting in successful products that have garnered international acclaim.

Conclusion: Glenn L Kehley's passion for innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors and shape the future of technology.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]