The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 30, 1997
Filed:
Aug. 01, 1995
Applicant:
Inventors:
William Louis Brodsky, Binghamton, NY (US);
Glenn Lee Kehley, Endicott, NY (US);
Sanjeev Balwant Sathe, Johnson City, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361704 ; 2989003 ; 165 803 ; 165185 ; 174 163 ; 257707 ; 257713 ; 361690 ; 361707 ;
Abstract
A heat sink structure with a heat-conducting base and wound wire heat conductors thermally attached to the base for use in electronic packaging structures, e.g., those used in computers. The method of making such a structure, as taught herein, provides a unique structure using wire to form the thermally conductive members in a corrugated shape and aligning these with and thermally coupling to a base structure. In one embodiment, the base structure may be excluded with a heat conductive spacer member used instead.