Binghamton, NY, United States of America

Sanjeev Balwant Sathe

This inventor holds 38 USPTO granted patents, primarily in Semiconductor Packaging. Top assignees: International Business Machines Corporation, International Business Corporation. Active years: 1997-2008.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Sanjeev Balwant Sathe. Retrieved from https://idiyas.com/inventor/sanjeev-balwant-sathe

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 71.1

Average Co-Inventor Count = 2.9

ph-index = 15

Forward Citations = 633(Granted Patents)


Location History:

  • Johnson City, NY (US) (1997 - 2007)
  • Binghamton, NY (US) (2001 - 2008)

Company Filing History:


Years Active: 1997-2008

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Areas of Expertise:
Wafer Scale Package
Thermal Management
Multichip Modules
Flip Chip Packages
Thermally Enhanced Lid
Stress Reduction
Thermal Conductive Packaging
Electronic Packages
Heat Sink Structures
Pulsating Flow
Chip Carriers
Optical Fiber Substrates
38 patents (USPTO):Explore Patents

Title: Innovations and Contributions of Sanjeev Balwant Sathe

Introduction

Sanjeev Balwant Sathe is a renowned inventor based in Binghamton, NY, known for his substantial contributions to the field of electronic packaging with a remarkable portfolio of 38 patents. His work has significantly advanced the capabilities of chip modules and multichip modules, showcasing his ingenuity in addressing thermal and mechanical challenges in electronic devices.

Latest Patents

Among his notable inventions, Sanjeev has developed a patented technology for a Wafer Scale Thin Film Package. This innovative chip module incorporates a flexible multilayer redistribution thin film, which serves both as a distribution medium for power and signals and as a compliant interface to mitigate stresses caused by thermal expansion mismatches between the chip and substrate. The design allows for the fabrication of modules at either the chip or wafer level, ensuring that the assembly process is both efficient and scalable.

Another significant patent is for a Thermally Enhanced Lid for Multichip Modules. This electronic package integrates a lid with a vapor chamber and a substrate having matching coefficients of thermal expansion. The invention ensures optimal thermal management by using a thermal transfer medium that connects the components effectively to the substrate, enhancing the performance and reliability of electronic packaging.

Career Highlights

Sanjeev has had a distinguished career, with key positions at major technology firms such as IBM and International Business Corporation. His experience at these leading companies has enriched his expertise and has provided him with a solid foundation to create innovative solutions for complex challenges in electronics.

Collaborations

Throughout his career, Sanjeev has collaborated with other eminent professionals in the field, including David James Alcoe and Glenn L. Kehley. These partnerships have fostered an environment of innovation and shared knowledge, leading to the development of various groundbreaking technologies.

Conclusion

Sanjeev Balwant Sathe exemplifies the spirit of innovation in the electronics industry. His 38 patents reflect a dedication to improving electronic packaging, addressing crucial thermal management issues, and enhancing device performance. With a collaborative approach and a track record of success, Sanjeev continues to be a significant contributor to advancements in technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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