Method and apparatus for separable interconnecting electronic components

Abstract

A socket connects electronic components such as integrated circuit modules with arrays of solder balls or columns, lands, pads of similar contacts to other components, typically substrates such as printed circuit boards. The socket has a polarization post and locator posts that extend through polarization and locator holes in the substrate and in a registration sheet that locates the module with respect to the substrate. The heads of the posts, which are all substantially the same size, extend through arcuate slots in a cam ring. Each of the slots has an inclined ramp that engages the heads of the post. When the cam ring is turned, the heads of the posts ride up the ramps, moving the cam ring towards the substrate and compressing a wave spring that presses against a pressure plate. The pressure plate in turn presses the module toward the substrate, providing a secure yet separable electrical connection between the contacts in the array on the module and contacts on the substrate, preferably through an electrical interposer positioned between the module and the substrate.