Gerry Balanon

Title: Gerry Balanon: Innovator in Semiconductor Technology

Introduction

Gerry Balanon is a prominent inventor based in Singapore, known for his contributions to semiconductor technology. With a total of 5 patents, he has made significant advancements in the field, particularly in the design and functionality of semiconductor packages.

Latest Patents

Among his latest patents is a semiconductor package with a heat sink. This innovative package includes a semiconductor device support substrate that features at least one interconnect metal connectible to a ground, along with an opening that exposes the surface of the interconnect metal. The heat sink is designed with elastic means that cooperate with the opening to securely position it to the semiconductor support substrate. Another notable patent is for a heat spreader interconnect for thermally enhanced PBGA packages. This patent describes a PBGA package where the heat spreader interfaces with the substrate, featuring a stand-off that is aligned with the substrate by means of a copper pad. The design includes a solder bump over the copper pad and thermally conductive solder deposited over the opening of the heat spreader.

Career Highlights

Gerry Balanon is currently employed at St Assembly Test Services Inc., where he continues to innovate in semiconductor technology. His work has been instrumental in enhancing the performance and reliability of semiconductor devices.

Collaborations

Gerry has collaborated with notable coworkers, including Il Kwon Shim and Seng Guan Chow, who contribute to the dynamic environment of innovation at their workplace.

Conclusion

Gerry Balanon stands out as a key figure in the semiconductor industry, with a strong portfolio of patents that reflect his expertise and commitment to advancing technology. His contributions are paving the way for future innovations in semiconductor packaging.