The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 18, 2003
Filed:
Apr. 05, 2002
St. Assembly Test Services Ltd., Singapore, SG;
Abstract
A new method and package is provided for face-up packaging of semiconductor devices. The semiconductor device is mounted over the surface of a semiconductor device support surface using conventional methods of device packaging up through device bond wire interconnect to electrical traces on the surface of the semiconductor device support surface over which the device is mounted. An internal mold cap is formed over the device, the internal mold cap has an opening exposing the surface of the device. An external mold cap is formed surrounding the internal mold cap with a cavity separating the external mold cap from the internal mold cap. Thermally conductive epoxy is deposited in the opening of the internal mold cap and in the cavity between the internal and the external mold cap. The heat spreader is placed and attached after which a thermal epoxy and mold cure is applied to the package. The package is further completed by the application of contact balls to a first surface of the semiconductor device support surface, the semiconductor devices is mounted has been mounted over a second surface of the semiconductor device support surface.