This inventor holds 2 USPTO granted patents. Top assignee: Samsung Electronics Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Geonho Kim and Semiconductor Memory Innovation
Introduction
Geonho Kim is an inventor based in Suwon-si, South Korea, whose patent work focuses on semiconductor memory systems and communication between vertically stacked dies. He is associated with Samsung Electronics Ltd. His listed portfolio includes 2 patents.
Latest Patents
Kim’s listed patents address memory controllers and signal communication in semiconductor devices that use vertically stacked dies.
“Memory controller communicating with vertically stacked dies and semiconductor device including the same” describes a semiconductor device with a core die and a logic die connected through through-silicon vias (TSVs). The logic die’s memory controller manages memory operations, while a physical-layer (PHY) region converts and aligns signals to support multi-phase communication between the logic die and core die.
A related patent with the same title describes four TSV circuit blocks that generate output signals at different phases. The blocks synchronize their signals with two clock signals and their respective inverted signals, enabling phased communication between the logic die and the core die.
Career Highlights
Kim’s patent work reflects an emphasis on memory-controller design, PHY signal processing, and high-bandwidth communication across stacked semiconductor dies. These technologies are relevant to advanced memory architectures that integrate logic and memory components.
Collaborations
The provided information lists Kyeongkeun Kang and Shinyoung Yi as Kim’s coworkers. It does not specify their roles in the patents or establish particular co-inventor relationships.
Conclusion
Geonho Kim’s listed inventions focus on improving communication between vertically stacked dies through protocol conversion and phased TSV signaling, contributing to the development of advanced semiconductor memory devices.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile