Singapore, Singapore

Genmao Liu

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: United Microelectronics Corp.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Genmao Liu. Retrieved from https://idiyas.com/inventor/genmao-liu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Genmao Liu and His Semiconductor Invention.

Introduction

Genmao Liu is an inventor associated with Singapore and United Microelectronics Corp. His patent work addresses semiconductor structure and manufacturing, with a focus on reducing ion infiltration into transistors and improving product yield.

Latest Patents

Liu is credited with 1 patent: “Semiconductor Structure with Silicon-on-Insulator Substrate and the Manufacturing Method Thereof.” The invention describes a silicon-on-insulator (SOI) substrate with a silicon layer and an insulating layer stacked from bottom to top. A phosphosilicate glass (PSG) layer is placed on the insulating layer, followed by a fluorosilicate glass (FSG) layer. The structure is intended to reduce the probability of ions infiltrating into transistors and improve product yield.

Career Highlights

Liu’s listed patent reflects work on semiconductor materials and device fabrication. The invention combines an SOI substrate with glass layers designed to support transistor protection and manufacturing performance.

Collaborations

Liu’s listed coworkers include Yueran Qiao and Yi Liu. His patent is associated with United Microelectronics Corp.

Conclusion

Genmao Liu’s patent describes a layered semiconductor structure intended to limit ion infiltration into transistors and improve product yield.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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