Geary L Chew

Title: Geary L Chew: Innovator in High-Frequency Electronic Interconnects

Introduction

Geary L Chew, an accomplished inventor based in Foster City, CA, has made significant contributions to the field of electronic interconnect technology. With a total of four patents to his name, Chew has developed innovative solutions that enhance the manufacturing processes and efficiency of electronic components.

Latest Patents

One of Chew's latest inventions is the "Surface Mountable Coaxial Solder Interconnect and Method." This invention presents a small, low-cost, passively self-aligning, high-frequency electronic interconnect that is designed for mass production. The interconnect includes a substrate featuring both a signal pad and an annular pad with signal and annular conductors that are wetted with reflowed solder. The design may also allow for a second substrate that includes corresponding signal and annular pads for enhanced functionality. The method entails utilizing a mask and substrate to achieve precise alignment when filling with solder paste and reflowing, thereby ensuring effective electrical connection.

Another noteworthy invention by Chew is the "Solder Paste Containment Device," which offers advancements for the formation and transfer of solder bumps in integrated circuit packaging. This device improves the donor substrate by reshaping the solder paste containment region to facilitate the protrusion of solder bumps during the reflow process, optimizing the proximity transfer to receiving substrates.

Career Highlights

Geary L Chew has had a notable career in the tech industry, including significant tenures at well-established companies such as Agilent Technologies, Inc. and Hewlett-Packard Company. His work has focused primarily on advancing interconnect technologies that are crucial for the efficiency and performance of electronic devices.

Collaborations

Throughout his career, Chew has collaborated with esteemed professionals in the sector, including Matthew K Schwiebert and Ron Jay Barnett. These collaborations have likely fostered an environment of innovative thought and shared expertise, leading to the development of his impactful patents.

Conclusion

Geary L Chew's work exemplifies the spirit of innovation in electronic interconnect technologies. His patented inventions not only offer practical solutions for high-frequency applications but also reflect the importance of collaboration and perseverance in the field of invention. As technology continues to evolve, inventors like Chew will remain at the forefront, driving the future of electronic advancements.