The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 24, 2000
Filed:
Jul. 31, 1998
Matthew K Schwiebert, Santa Rosa, CA (US);
Brian R Hutchison, Windsor, CA (US);
Geary L Chew, Foster City, CA (US);
Ron Barnett, Santa Rosa, CA (US);
Agilent Technologies Inc., Palo Alto, CA (US);
Abstract
A surface mountable high frequency electronic package consisting of substrates stacked on top of each other, with arbitrarily-shaped solder structures such as balls and walls connecting them together; forming a fully-shielded, environmentally-sealed, sandwich in which smaller electronic components and devices are placed. In addition to providing electronic and mechanical interconnection to a mother substrate, the solder structures also provide electromagnetic isolation and shielding, controlled-impedance transmission line structures, and an environmental seal. The entire package is fabricated from conventional materials and components assembled together with automated processes.