The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 31, 2000
Filed:
Oct. 26, 1998
Applicant:
Inventors:
Gary R Trott, San Mateo, CA (US);
Geary L Chew, Foster City, CA (US);
Matthew K Schwiebert, Santa Rosa, CA (US);
Assignee:
Agilent Technologies Inc., Palo Alto, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B / ; B23K / ;
U.S. Cl.
CPC ...
428458 ; 428446 ; 4284735 ; 228 41 ; 228 563 ;
Abstract
The invention provides an improved donor substrate for the formation and transfer of solder bumps useful in IC packaging and related interconnect applications. The donor substrate is improved by shaping the solder paste containment region (cavity) so that during reflow, the solder bump is urged to protrude significantly above the surface of the donor substrate, enabling proximity transfer of the solder bump to a receiving substrate.