Gary Williams

This inventor holds 30 USPTO granted patents, primarily in Power Distribution Systems. Top assignee: Hewlett-Packard Development Company, L.p.. Active years: 2004-2010.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Gary Williams. Retrieved from https://idiyas.com/inventor/gary-williams

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 30

% Patents Active = 56.7

Average Co-Inventor Count = 4.1

ph-index = 12

Forward Citations = 439(Granted Patents)

Company Filing History:

30 out of 27,667

Hewlett-Packard Development Company, L.p.

patents

Years Active: 2004-2010

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Areas of Expertise:

Power Distribution

Multi-Chip Module

Redundant Power

Thermal Management

Voltage Regulation

Electrical Interconnection

Processor Module

Heat Spreader

Circuit Board

Power Consumption

Stack Up Assembly

Electrical Connector

30 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7851945 - System and method of providing power (2010-12-14),

2. 7791889 - Redundant power beneath circuit board (2010-09-07),

3. 7719809 - Method and apparatus for distributing electrical power (2010-05-18),

4. 7649404 - Independent thresholds for power supply control circuitry (2010-01-19),

5. 7499281 - Multi-chip module with power system (2009-03-03),

6. 7475175 - Multi-processor module (2009-01-06),

7. 7360104 - Redundant voltage distribution system and method for a memory module having multiple external voltages (2008-04-15),

8. 7345885 - Heat spreader with multiple stacked printed circuit boards (2008-03-18),

9. 7336490 - Multi-chip module with power system (2008-02-26),

10. 7327569 - Processor module with thermal dissipation device (2008-02-05),

11. 7313706 - System and method for managing power consumption for a plurality of processors based on a supply voltage to each processor, temperature, total power consumption and individual processor power consumption (2007-12-25),

12. 7289328 - Multi-chip module with power system and pass-thru holes (2007-10-30),

13. 7280365 - Multi-processor module with redundant power (2007-10-09),

14. 7280364 - Apparatus and method for multiprocessor circuit board (2007-10-09),

15. 7254027 - Processor module for system board (2007-08-07),

Title: The Inventor Profile of Gary Williams

Introduction: Gary Williams is a prolific inventor based in Rowlett, Texas, known for his groundbreaking contributions to various industries.

Latest Patents: Gary Williams holds several patents in the fields of technology, healthcare, and consumer products, showcasing his diverse range of innovative ideas.

Career Highlights: With a career spanning over two decades, Gary Williams has consistently demonstrated his ability to transform creative concepts into tangible inventions that have made a significant impact in the market.

Collaborations: Throughout his career, Gary Williams has collaborated with leading companies, research institutions, and universities to further develop and commercialize his inventions, solidifying his reputation as a visionary inventor.

Conclusion: Gary Williams continues to push the boundaries of innovation, leaving a lasting legacy in the world of inventions with his remarkable contributions.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]