Hewlett-packard Development Company, L.p.

Gary Williams

Shaun Lee Harris

Christian Laszlo Belady

Eric C Peterson

Steven A Belson

Brent A Boudreaux

Paul Anthony Wirtzberger

Stuart C Haden

Jeffrey Christenson

Rico Brooks

Stephan Karl Barsun

Roy M Zeighami

Jeffrey Allan Oberski

Michael C Day

Jeffrey N Metcalf

John K Sikora

James Steven Wells

Michael McHugh

David A Klein

Greg Huff

Circuits and methods of providing power to an electric load are disclosed. The method includes the steps of, for example, generating power via at least first and second parallel power supplies, in response to the first power supply exhibiting an over-voltage, disabling a reverse current threshold on the second power supply, turning off the first power supply when the over-voltage exceeds a threshold value, and continuing to generate power via the second power supply.

System and method of providing power

One embodiment includes an electronic assembly having a first printed circuit board (PCB) and a second PCB. The second PCB has at least two processors and is coupled to and disposed on a first side of the first PCB. A thermal dissipation device dissipates heat away from the processors. First and second power modules are coupled to and disposed on a second side of the first PCB, the first and second power modules providing redundant power to the two processors on the second PCB.

Redundant power beneath circuit board

A method and apparatus for distributing electrical power is provided. In one embodiment, the apparatus includes: a semiconductor switch adapted to receive input power from a DC power source, adapted to distribute power to a DC/DC module, and adapted to receive a control signal, a charge storage device in operative communication with the semiconductor switch and a return path associated with the DC power source, and a reverse current monitoring logic in operative communication with the semiconductor switch. In this embodiment, the reverse current monitoring logic is adapted to detect reverse current flowing in the semiconductor switch and, in response to detecting the reverse current, is adapted to open the semiconductor switch. Several embodiments of a method of distributing electrical power to a DC load are also provided.

Method and apparatus for distributing electrical power

A system may comprise a control system that controls a state of a switch network, the control system having first and second thresholds that determine the state of the switch network based on the relative voltages at an input and an output of the switch network. A scaling network is coupled across the input and the output of the switch network and providing a gain scaling signal to a first input of the control system. An offset network is coupled to the output of the switch network and providing an offset signal to a second input of the control system, the first threshold being set independently of the second threshold based on the gain scaling signal and the offset signal.

Independent thresholds for power supply control circuitry

Embodiments include apparatus, methods, and systems having a multi-chip module with a power system. An exemplary electronic module includes a printed circuit board (PCB) having a memory and plural processors. A power system couples to and is disposed vertically above the PCB. A thermal dissipation device is disposed between the power system and the PCB for dissipating heat, via a direct heat exchange, from both the power system and the plural processors.

Multi-chip module with power system

An apparatus comprises a plurality of logically independent processors, a system bus, and a cache control and bus bridge device in communication with the plurality of processors such that the cache control and bus bridge device is logically interposed between the processors and the system bus, and wherein the processors and cache control and bus bridge device are disposed in a module form factor such that the apparatus is a drop-in replacement for a standard single processor module.

Multi-processor module

A memory assembly module including an on-board voltage regulator for converting an externally supplied voltage into appropriate local voltage levels for powering memory devices of the memory assembly module.

Redundant voltage distribution system and method for a memory module having multiple external voltages

A heat spreader with multiple stacked printed circuit boards (PCBS) includes top and side sections within which a first PCB is contained and bottom edges that extend to a second PCB. The heat spreader and second PCB substantially enclose the first PCB therein.

Heat spreader with multiple stacked printed circuit boards

Embodiments include apparatus, methods, and systems of a processor module for a system board. An electronic module is removably connectable to a system board. The electronic module has first and second portions. The first portion is connected to the system board and includes a thermal dissipation device and a printed circuit board (PCB) with a processor connected to a first side of the PCB. The thermal dissipation device extends between the processor and the system board. The second portion connects on top of the first portion and has a power system board for providing power to the processor. The power system board extends adjacent and parallel to a second side of the PCB.

Processor module with thermal dissipation device

An electronic processing system contains a power supply subsystem and a multi-processor module. Programmable control circuitry manages power consumption in the electronic system by allocating priority among a plurality of competing demands, such as total power consumption, power consumption at any one of the processors, and thermal measurements. Analog sense measurements of incoming power are transmitted to the control circuits, which are protected from noise through use of an isolation barrier established by a linear isolation amplifier.

System and method for managing power consumption for a plurality of processors based on a supply voltage to each processor, temperature, total power consumption and individual processor power consumption

Embodiments include apparatus, methods, and systems having a multi-chip module with a power system and pass-thru holes. An exemplary electronic module includes a first portion having a first printed circuit board (PCB) with a memory and plural processors. A second portion has a power system and a thermal dissipation device. The thermal dissipation device has plural extensions, and the power system has plural pass-thru holes. The first portion electrically couples to the second portion to form the electronic module when the plural extensions extend through the plural pass-thru holes of the power system and through plural pass-thru holes of a second PCB disposed between the first and second portions.

Multi-chip module with power system and pass-thru holes

One embodiment includes an electronic assembly having a first printed circuit board (PCB) coupled to a second PCB. The second PCB has at least two processors and is disposed above the first PCB. A thermal dissipation device is disposed above the second PCB, dissipates heat away from the two processors, and provides an airflow path. A power system is adjacent the thermal dissipation device and in a pathway of the airflow path.

Apparatus and method for multiprocessor circuit board

One embodiment includes an electronic assembly having a first printed circuit board (PCB) and a second PCB having at least two processors. The second PCB is coupled to and disposed above the first PCB. A thermal dissipation device dissipates heat away from the processors. First and second power modules supply power to the second PCB and are separated and redundant power supplies such that upon failure of the first power module, the second power module can provide power for both power modules to the second PCB.

Multi-processor module with redundant power

Embodiments include apparatus, methods, and systems of a processor module for a system board. In one embodiment, an electronic module, having first and second portions, is removably connectable to the system board. The first portion connects to the system board and includes a thermal dissipation device and a printed circuit board (PCB) with a processor connected to a first side of the PCB. The thermal dissipation device dissipates heat, via a heat exchange, from the processor. The second portion is disposed in a space created between the first portion and the system board. The second portion has a power system board for providing power to the processor. The power system board extends adjacent and parallel to a second side of the PCB.

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Rowlett, TX, United States of America

Gary Williams