North Wales, PA, United States of America

Gary S Gillotti

USPTO Granted Patents = 14 

Average Co-Inventor Count = 1.5

ph-index = 4

Forward Citations = 164(Granted Patents)


Location History:

  • Telford, PA (US) (1988)
  • Bensalem, PA (US) (2009)
  • Lansdale, PA (US) (2011 - 2012)
  • North Wales, PA (US) (2014 - 2023)

Company Filing History:


Years Active: 1988-2025

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14 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Gary S. Gillotti

Introduction

Gary S. Gillotti is a notable inventor based in North Wales, PA, with a remarkable portfolio of 14 patents. His work primarily focuses on advancements in wire bonding technology, which is crucial in the semiconductor industry. His innovative methods have significantly improved the efficiency and reliability of bonding processes.

Latest Patents

Among his latest patents, Gillotti has developed methods for detecting bonding between a bonding wire and a bonding location on a wire bonding machine. One of his methods involves determining the bonding status between wire and at least one bonding location of a semiconductor device. This method includes bonding a portion of wire to a bonding location using a bonding tool and detecting whether another portion of wire, engaged with the bonding tool, contacts the bonded portion within a predetermined height range. Another patent outlines a method for determining bonding status by analyzing the motion profile of the bonding tool, ensuring that the wire is broken during the motion if it is not properly bonded.

Career Highlights

Gillotti has had a distinguished career, working with prominent companies such as Kulicke and Soffa Industries, Inc. and Kulicke & Soffa Ind. Inc. His contributions to these organizations have been instrumental in advancing wire bonding technologies.

Collaborations

Throughout his career, Gillotti has collaborated with notable professionals, including David A. Leonhardt and Stanley Szczesniak. These collaborations have fostered innovation and development in the field of semiconductor manufacturing.

Conclusion

Gary S. Gillotti's contributions to wire bonding technology through his patents and collaborations have made a significant impact on the semiconductor industry. His innovative methods continue to enhance the efficiency and reliability of bonding processes, showcasing his dedication to advancing technology.

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