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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9455544 B1

PDFFull Text
Date of Patent:
Sep. 27, 2016

Filed:

Aug. 03, 2011

Wire loops, methods of forming wire loops, and related processes

Applicant:

Gary S. Gillotti, North Wales, PA (US);

Inventor:

Gary S. Gillotti, North Wales, PA (US);

Assignee:

Kulicke and Soffa Industries, Inc., Fort Washington, PA (US);

Attorney:

Stradley Ronon Stevens & Young, LLP

Primary Examiner:

Kiley Stoner

Int. Cl.
CPC ...
B23K 31/02 (2006.01); H01R 43/00 (2006.01); B23K 20/00 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01R 43/00 (2013.01); B23K 20/005 (2013.01); B23K 20/007 (2013.01); H01L 24/48 (2013.01); H01L 24/85 (2013.01); H01L 24/45 (2013.01); H01L 24/78 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/45565 (2013.01); H01L 2224/45664 (2013.01); H01L 2224/48095 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48471 (2013.01); H01L 2224/48478 (2013.01); H01L 2224/48479 (2013.01); H01L 2224/48599 (2013.01); H01L 2224/48699 (2013.01); H01L 2224/78301 (2013.01); H01L 2224/829 (2013.01); H01L 2224/82045 (2013.01); H01L 2224/85051 (2013.01); H01L 2224/85186 (2013.01); H01L 2224/85203 (2013.01); H01L 2224/85205 (2013.01); H01L 2224/85986 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); Y10T 29/49117 (2015.01);
Abstract

A method of forming a wire loop is provided. The method includes the steps of: (1) forming a conductive bump on a bonding location using a wire bonding tool; (2) bonding a portion of wire to another bonding location using the wire bonding tool; (3) extending a length of wire from the bonded portion of wire toward the bonding location; (4) lowering the bonding tool toward the bonding location while detecting a height of a tip of the wire bonding tool; and (5) interrupting the lowering of the wire bonding tool during step (4) if the wire bonding tool reaches a predetermined height.

Find Patent Forward Citations

Gillotti, Gary. (2016). Wire loops, methods of forming wire loops, and related processes (U.S. Patent No. 9455544). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9455544

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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