The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2015

Filed:

Jan. 09, 2015
Applicant:

Kulicke and Soffa Industries, Inc., Fort Washington, PA (US);

Inventor:

Gary S. Gillotti, North Wales, PA (US);

Assignee:

Kulicke and Soffa Industries, Inc., Fort Washington, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 31/02 (2006.01); H01L 21/66 (2006.01); H01L 23/00 (2006.01); B23K 20/00 (2006.01);
U.S. Cl.
CPC ...
H01L 22/12 (2013.01); B23K 20/004 (2013.01); B23K 20/005 (2013.01); B23K 20/007 (2013.01); H01L 22/14 (2013.01); H01L 24/85 (2013.01); H01L 2224/4845 (2013.01); H01L 2224/78821 (2013.01); H01L 2224/851 (2013.01); H01L 2224/859 (2013.01); H01L 2224/85365 (2013.01);
Abstract

A method of operating a wire bonding machine is provided. The method includes: detecting a short tail condition after formation of a wire bond formed using a wire bonding tool; providing a bond head assembly of a wire bonding machine at an xy location of the wire bonding machine, the bond head assembly carrying the wire bonding tool; lowering the bond head assembly toward a contact surface at the xy location with a wire clamp of the wire bonding machine closed; opening the wire clamp; decelerating the bond head assembly as it is lowered toward the contact surface such that a portion of a wire extends below a tip of the wire bonding tool; closing the wire clamp; and performing a test to determine if an end of the portion of the wire extending below the tip of the bonding tool is in contact with the contact surface.


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