The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2022
Filed:
Jul. 16, 2020
Methods of detecting bonding between a bonding wire and a bonding location on a wire bonding machine
Applicant:
Kulicke and Soffa Industries, Inc., Fort Washington, PA (US);
Inventor:
Gary S. Gillotti, North Wales, PA (US);
Assignee:
Kulicke and Soffa Industries, Inc., Fort Washington, PA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 22/12 (2013.01); H01L 24/78 (2013.01); H01L 24/85 (2013.01); H01L 2224/789 (2013.01); H01L 2224/859 (2013.01);
Abstract
A method of determining a bonding status between wire and at least one bonding location of a semiconductor device is provided. The method includes the steps of: (a) bonding a portion of wire to at least one bonding location of a semiconductor device using a bonding tool of a wire bonding machine; and (b) detecting whether another portion of wire engaged with the bonding tool, and separate from the portion of wire, contacts the portion of wire in a predetermined height range, thereby determining if the portion of wire is bonded to the at least one bonding location.