Gary O Henderson is a notable inventor based in Meridian, ID (US). He has made significant contributions to the field of micro-device workpiece polishing through his innovative designs and patents. With a total of 6 patents to his name, Henderson has established himself as a key figure in his industry.

Latest Patents

Henderson's latest patents focus on end effectors and methods for manufacturing end effectors with contact elements designed to condition polishing pads used in polishing micro-device workpieces. One of his notable inventions includes an end effector that features a member with a first surface and a plurality of uniformly shaped contact elements attached to it. These contact elements project transversely from the first surface and can take various forms, including conical, frusto-conical, and cylindrical shapes. Additionally, the contact elements are designed with a wear-resistant layer, which may include materials such as carbon-like diamond, silicon, or silicon carbide. The rounded tips of these contact elements enhance their effectiveness in conditioning polishing pads.

Career Highlights

Henderson is currently associated with Micron Technology Incorporated, where he continues to innovate and develop new technologies. His work has been instrumental in advancing the capabilities of polishing processes for micro-device workpieces.

Collaborations

Henderson collaborates with Aaron T Bartlett, contributing to the development of cutting-edge technologies in their field.

Conclusion

Gary O Henderson's contributions to the field of micro-device polishing through his innovative patents and collaborations highlight his importance as an inventor. His work continues to influence advancements in technology and manufacturing processes.

Profile summary based on public USPTO records.

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